0.3mm DSP Sapphire Wafer Substrate Or Customized Thickness
The Kyropoulos process (KY process) for sapphire crystal growth is currently used by many companies in China to produce sapphire for the electronics and optics industries.
High-purity, aluminum oxide is melted in a crucible at over 2100 degrees Celsius. Typically the crucible is made of tungsten or molybdenum. A precisely oriented seed crystal is dipped into the molten alumina. The seed crystal is slowly pulled upwards and may be rotated simultaneously. By precisely controlling the temperature gradients, rate of pulling and rate of temperature decrease, it is possible to produce a large, single-crystal, roughly cylindrical ingot from the melt.
After single crystal sapphire boules are grown, they are core-drilled into cylindrical rods, The rods are sliced up into the desired window thickness and finally polished to the desired surface finish.
Sapphire Windows are manufactured from single crystal sapphire, making them ideal for demanding applications (such as laser systems) because of their extreme surface hardness, high thermal conductivity, high dielectric constant and resistance to common chemical acids and alkalis. Sapphire is the second hardest crystal next to diamonds and, because of their structural strength, sapphire windows can be made much thinner than other common dielectric windows with improved transmittance. Chemically, sapphire is single crystal aluminum oxide (Al2O3), and is useful in a transmission range from 0.2 - 5.5µm.
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We can supply professional customized service in time and provide cooperation and support of new product development and technology appliance.
Applications
Sapphire Washers, Sapphire Windows, Sapphire Bearings, Sapphire Rods, Sapphire Tubes, Ruby
sapphire wafer, dome sapphire, Sapphire insulation Film, Sapphire ball lens, Sapphire/ruby ball
2inch 2°off C-plane specification
Material: Single crystal Al2O3 99.999％
Orientation: 4°off C-plane(0001) to M -axis±0.1°,
Diameter:50.80±0.2mm
Thickness 500±15um or 750±15um or 1000±15um
Primary flat:16±1mm
OF Orientation flat: A axis±0.1°
Frontside Surface Roughness:Ra＜0.3nm
Backside Surface Roughness: 0.8~1.2um
( Or double side polished, both side Ra＜0.3nm)
TTV:＜15um
BOW:-15~0um
WARP:＜15um
Laser Mark Series No. by needs
Package:Vacuum-sealed containers with nitrogen backfill in a class 100 environment
Cleanliness :Free visible contamination
Process step for sapphire glass
FAQ:
Q: What's the way of shipping and cost?
A:(1) We accept DHL, Fedex, EMS etc.
(2) If you have your own express account, it's great.If not,we could help you ship them.
Freight is in accordance with the actual settlement.
Q: How to pay?
A: 50％ deposit,50％ before delivery T/T, Paypal,
we can provide Secure payment and Assurance payment .
Q: What's your MOQ?
A: (1) For inventory, the MOQ is 10-30pcs.
(2) For customized products, the MOQ is 25pcs up.
Q: What's the delivery time?
A: (1) For the standard products
For inventory: the delivery is 5 workdays after you place the order.
For customized products: the delivery is 2 or 3 weeks after you place the order.
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0.3mm DSP Sapphire Wafer Substrate Customized Thickness Images
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